Abstract
In small form factor devices, mounting for fastening thermal solutions are constrained. This is particularly challenging when surface-mount technology (SMT) components require cooling on both the primary and secondary sides of a two-sided printed circuit board (PCB) assembly. This disclosure describes techniques to optimize the physical stability of thermal solutions by balancing the load across different surface-mount technology (SMT) components that require cooling. Per the techniques, a sliding, spring-loaded captive screw is attached to the primary thermal solution by way of through-travel of a threaded section that is precisely controlled for thread pitch and length such that it can rotate freely after passing through each threaded interface in the thermal solutions and the SMT nut. The free rotation allows the screw to engage with the entry point of threads on the proximal interface without cross-threading. The threaded interface of a secondary thermal solution engages with the threaded section of captive screw from the primary side thermal solution. The described techniques leverage a combination of different elements to achieve stability while improving system density.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
n/a, "Compact Dual-Sided Thermal Solution Retention for High Component Density", Technical Disclosure Commons, (September 13, 2024)
https://www.tdcommons.org/dpubs_series/7355